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mpx4250a rev 6, 12/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. integrated silicon pressure sensor manifold absolute pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpx4250a/mpxa4250a series mani fold absolute pressure (map) sensor for engine control is designed to sense absolute air pressure within the intake manifold. this measurement can be used to compute the amount of fuel required for each cylinder. the mpx4250a/mpxa4250a series piezor esistive transducer is a state-of- the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. the small form factor and high reliability of on-chip integration make the freescale sensor a logical and economical choice for the automotiv e system engineer. features ? 1.5% maximum error over 0 to 85 c ? specifically designed for intake manifold absolute pressure sensing in engine control systems ? patented silicon shear stress strain gauge ? temperature compensated over -40 to +125 c ? offers reduction in weight and volume compared to existing hybrid modules ? durable epoxy unibody element or th ermoplastic small outline, surface mount package ? ideal for non-automotive applications typical applications ? turbo boost engine control ? ideally suited for mi croprocessor or microcontroller-based systems ordering information device type options case no. mpx series order number packing options device marking small outline package (1) (mpxa4250a series) 1. the mpxa4250a series pressure sensors ar e available in the basic element package or with pressure port fitting. two pac king options are offered for each type. basic elements absolute, element only 482 mpxa4250a6u rails mpxa4250a 482 mpxa4250a6t1 tape & reel mpxa4250a ported elements absolute, axial port 482a mpxa4250ac6u rails mpxa4250a 482a MPXA4250AC6T1 tape & reel mpxa4250a unibody package (2) (mpx4250a series) 2. the mpx4250a series pressure sensors ar e available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections. basic element absolute, element only 867 mpx4250a ? mpx4250a ported elements absolute, ported 867b mpx4250ap ? mpx4250ap mpx4250a mpxa4250a series mpxa4250a6u/6t1 case 482-01 integrated pressure sensor 20 to 250 kpa (2.9 to 36.3 psi) 0.2 to 4.9 v output small outline packages mpxa4250ac6u/c6t1 case 482a-01 small outline package pin numbers 1 n/c (1), (2) 1. pin 1 in noted by the notch in the lead. 2. pins 1, 5, 6, and 7 are internal device connections. do not c onnect to external circuitry or ground. 5 (2) n/c 2 v s 6 (2) n/c 3 gnd 7 (2) n/c 4 v out 8 n/c unibody package pin numbers 1 v out (1) 1. pin 1 in noted by the notch in the lead. 4 n/c (2) 2. pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. 2 gnd 5 n/c (2) 3 v s 6 n/c (2) unibody packages mpx4250ap case 867b-04 mpx4250a case 867-08
mpx4250a sensors 2 freescale semiconductor figure 1. fully integrated pressure sensor schematic table 1. maximum ratings (1) 1. tc = 25c unless otherwise noted. rating symbol value unit maximum pressure (2) (p1 > p2) 2. exposure beyond the specified limits may c ause permanent damage or degradation to the device. p max 1000 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c thin film temperature compensation and gain stage #1 v s sensing element v out gnd gain stage #2 and ground reference shift circuitry pins 4, 5, and 6 are no connects for unibody device pins 1, 5, 6, 7, and 8 are no connects for small outline package device.
mpx4250a sensors freescale semiconductor 3 table 2. operating characteristics (v s = 5.1 v dc , t a = 25c unless otherwise noted, p1 > p2, decoupling circuit shown in figure 3 required to meet elec trical specifications.) characteristic symbol min typ max units differential pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 20 ? 250 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.85 5.1 5.35 v dc supply current i o ? 7.0 10 madc minimum pressure offset (3) (0 to 85c) @ v s = 5.1 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.133 0.204 0.264 v dc full scale output (4) (0 to 85c) @ v s = 5.1 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.826 4.896 4.966 v dc full scale span (5) (0 to 85c) @ v s = 5.1 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ? 4.692 ? v dc accuracy (6) (0 to 85c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation at any temperature from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differ ential pressure applied. ? pressure hysteresis: output deviation at any pressure within t he specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25c. ? tcspan: output deviation over the temperature range of 0 to 85c, relative to 25c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85c, relative to 25c. ? variation from nominal: the variation from nominal values, fo r offset or full scale span, as a percent of vfss, at 25c. ? ? ? 1.5 %v fss sensitivity ? v/ ? ? 20 ? mv/kpa response time (7) 7. response time is defined as the time form the incremental c hange in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t r ? 1.0 ? msec output source current at full scale output i o + ? 0.1 ? madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure is stab ilized. ? ? 20 ? msec offset stability (9) 9. offset stability is the product?s output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. ? ? 0.5 ? %v fss table 3. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, small outline package (case 482) 1.5 grams
mpx4250a sensors 4 freescale semiconductor figure 2. cross sectional diagram (not to scale) figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx4250a/mpxa4250a series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for interfacing the output of the in tegrated sensor to the a/d input of a microprocessor or microcontroller. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over temperature range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. figure 4. output vs. absolute pressure florosilicone die coat wire bond rtv die bond die p1 p2 epoxy case lead frame sealed vacuum reference stainless steel metal cover 1.0 f 470 pf vs + 5 v 0.01 f gnd vout ips output output (volts) 5.0 4.5 4.0 3.5 3.0 max 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 min typ pressure (ref: to sealed vacuum) in kpa transfer function: v out = v s * (0.004 x p-0.04) error v s = 5.1 vdc temp = 0 to 85c
mpx4250a sensors freescale semiconductor 5 transfer function nominal transfer value: v out = v s (p 0.004 - 0.04) (pressure error temp. factor 0.004 v s ) v s = 5.1 v 0.25 v dc temperature error band temp multiplier - 40 3 0 to 85 1 +125 3 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor temperature in c note: the temperature multiplier is a linear re sponse from 0 to -40 c and from 85 to 125c. pressure error (max) 20 to 250 kpa 3.45 (kpa) pressure (kpa) 75 100 125 150 175 200 225 25 50 250 4.0 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.0 5.0 0 pressure error (kpa) pressure error band
mpx4250a sensors 6 freescale semiconductor information for using the small outline package (case 482) minimum recommended footprint fo r surface mounted applications surface mount board la yout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. sop footprint (case 482) 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
package dimensions s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. case 482-01 issue o small outline package pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s case 482a-01 issue a small outline package mpx4250a sensors freescale semiconductor 7
package dimensions pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). case 867-08 issue n unibody package mpx4250a sensors 8 freescale semiconductor
case 867b-04 issue g unibody package page 1 of 2 package dimensions mpx4250a sensors freescale semiconductor 9
package dimensions mpx4250a sensors 10 freescale semiconductor case 867b-04 issue g unibody package page 2 of 2
mpx4250a sensors freescale semiconductor 11 notes
mpx4250a rev. 6 12/2006 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2006. all rights reserved.

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